On December 24, 2008, Visintin, Pamela; Jiang, Ping; Korzenski, Michael; King, Mackenzie; Han, Jianwen; Hilgarth, Monica; Liu, Jun; Zhou, Renjie; Minsek, David published a patent.Quality Control of 3-Amino-7-(diethylamino)-5-phenylphenazin-5-ium chloride The title of the patent was Removal composition for wafer reclamation and methods. And the patent contained the following:
A removal composition comprises at least one mineral acid, at least one etchant, at least one oxidizing agent, and optionally water, wherein the removal composition is suitable for removing SiC and/or SiC:N from a microelectronic device structure having the material thereon. The removal composition preferably includes hydrofluoric acid. The composition achieves substantial removal of the material(s) to be removed while not damaging the layers to be retained, for reclaiming, reworking, recycling and/or reuse of said structure. Processes include the monitoring and modifying the compositions The experimental process involved the reaction of 3-Amino-7-(diethylamino)-5-phenylphenazin-5-ium chloride(cas: 4569-86-2).Quality Control of 3-Amino-7-(diethylamino)-5-phenylphenazin-5-ium chloride
The Article related to mineral acid etchant oxidizing agent microelectronic device cleaning, Surface Active Agents and Detergents: Cleaning Compositions and other aspects.Quality Control of 3-Amino-7-(diethylamino)-5-phenylphenazin-5-ium chloride
Referemce:
Chloride – Wikipedia,
Chlorides – an overview | ScienceDirect Topics