Dow, Wei-Ping; Li, Chih-Chan; Lin, Meng-Wen; Su, Ging-Wen; Huang, Chen-Chia published an article in 2009, the title of the article was Copper Fill of Microvia Using a Thiol-Modified Cu Seed Layer and Various Levelers.Electric Literature of 4569-86-2 And the article contains the following content:
Microvia filling by Cu electroplating was carried out using a plating bath containing a suppressor and a leveler without an accelerator. The required accelerator was adsorbed onto the Cu seed layer of the microvia in a predipping bath before the filling plating. This pretreatment is similar to the self-assembled monolayer of thiol mols. that forms on a Cu surface. The suppressor was poly(ethylene glycol) (PEG), and 5 levelers, namely, Janus green B, diazine black, methylene violet, safranine O, and Alcian blue, were employed to screen for the best plating formula suitable for a plating process in which no accelerator was present in the plating solution The thiol mol. employed in this work was 3-mercapto-1-propanesulfonate (MPS). The electrochem. behaviors of various plating formulas were characterized using a galvanostatic measurement on a Cu electrode at different rotating speeds. The MPS adlayer is transferable onto the surface of the Cu deposit and can be displaced by the PEG-Cl-leveler. The displacement rate depends on the mol. structure of the added leveler. This plating process has the potential to greatly reduce the plating time of microvia filling. The experimental process involved the reaction of 3-Amino-7-(diethylamino)-5-phenylphenazin-5-ium chloride(cas: 4569-86-2).Electric Literature of 4569-86-2
The Article related to copper electroplating microvia filling thiol modified seed layer, various leveler copper electroplating thiol modified seed layer, Electrochemistry: Industrial Cathodic Processes and other aspects.Electric Literature of 4569-86-2
Referemce:
Chloride – Wikipedia,
Chlorides – an overview | ScienceDirect Topics